Curtiss-Wright Controls Embedded Computing (CWCEC) is committed to maintaining the high reliability of its products for the aerospace & defense (A&D) sector. The introduction of lead-free components and assemblies into A&D systems poses a potential reliability risk if the proper measures are not taken, beginning with understanding the various risks and implementing effective mitigations. In addition, the overall process of controlling if, when, and how lead-free is introduced needs to be addressed through a comprehensive lead-free control plan (LFCP).
Figure 1. Lead-free failure modes (tin whiskering, pad cratering, delamination, solder joint cracking)
CWCEC has performed extensive studies and testing of lead-free soldering and assembly, and has implemented best practices for the production of lead-free assemblies. These results are available to customers interested in the reliability of lead-free products. CWCEC will continue to research and test new approaches for managing lead-free, and will continue its involvement in industry activities to leverage leading edge knowledge, such as PERM and the Lead-free Manhattan Project.
Figure 2. Lead-free testing and characterization (thermal cycling and random vibration)
At the same time, most of our products continue to be produced using tin-lead solder, with its known heritage of reliability. The determination of whether or not a product is produced as lead-free must be made through careful consideration of critical factors like cost, lead time and reliability. If required, our lead-free products can be offered as tin-lead versions.
The global lead-free movement is causing a significant impact to the A&D industry. Nevertheless, CWCEC remains committed to maintaining its position as an industry leader in high reliability and high performance products.
