|
|
3CPF1-ENC-0001 7-slot Chassis
The 3CPF1 FPGA/PowerPC processor card has been designed to provide intensive processing power balanced with the newest generation of multi-Gigabit/s serial communications to rugged systems. To ease system development, VMETRO provides system designers with a 'standard' backplane and enclosure for 3U boards. The backplane itself provides three processor slots, IO and 2x 3U CompactPCI slots.
Features
- 6U x 300mm deep cardframe assembly
- 7x slot 3U enclosure: 3x 3CPF1, 2x cPCI, 2x front panel I/O
- 650W ATX power supply mounted at rear
- 2x 120mm diameter 100CFM cooling fans with air baffle plates
- 19" Rack mount enclosure
Enclosure
Two 120mm diameter 100CFM cooling fans with air baffle plates draw cooling air in at the lower front, exhausting through upper rear. The 6U card frame x 300mm deep (approx) is configured for 160mm 3U front plug-in cards and 80mm rear transition cards. There is space for rear transition cards behind all CPCI slots. A Front panel push button is linked to 'prst' on the system slot which drives the system pci_reset signal. There is also a PSU Inhibit switch on lower front panel.
3CPF1-BP1 Backplane
The current generation of 3U compactPCI connectors that adhere to the PICMG 2.0 specification do not have the electrical characteristics necessary to support signalling rates above 2GHz.
To improve the available bandwidth, 3CPF1 boards route I/O to the backplane through ERNI ERmet ZD connectors which are specifically designed for high speed differential signalling to data rates of 5Gbps. These replace the standard connectors in the J2 and J3 position of a 3U cPCI interface. This means that the 3CPF1 does not fit directly into a standard 3U cPCI backplane, but instead requires a 3CPF1-specific backplane. For developers embarking on a new 3U system design, where they would need to specify customized I/O anyway, using the 3CPF1 presents an ideal opportunity to balance intensive processing with greatly increased system bandwidth.
The 3CPF1-BP1 allows customers to take advantage of the high speed signals for backplane communications without the need to create a custom backplane from scratch.
Multi Gbps Serial links
The 3CPF1-BP1 is set out so that each 3CPF1 has four 3.125Gbps serial RocketIO channels connected to each of the other two 3CPF1 boards via the backplane. The interconnection forms a 'triangle'.
PCI
Two PICMG 2.0 R3.0 standard 3U CompactPCI slots are also provided by the backplane, connecting with each of the 3CPF1 boards over a standard 32-bit, 66MHz PCI interface through standard J1 connectors.
General I/O
The 3CPF1-BP1 routes the system's differential signals, PMC user I/O signals and Ethernet + other serial data to special I/O slots.
Slot 1 of the backplane is for a general I/O card. 20 differential pairs are routed to this slot from slot 5 and another 40 differential pairs are routed from slot 4.
From Slot 6, which is a standard cPCI slot, 64 lines of PMC user I/O connections are available.
Slot 2 of the backplane is for Ethernet and serial I/O, but also has some differential signals routed to it. The Ethernet and serial card slot can support 2 Gigabit Ethernet, 1 RS-232 and 1 RS422 connections from each 3CPF1 slot. From slot 5, 20 differential pairs are routed, plus another 27 from the system slot, slot 3.
Note: The 3CPF1-BP1 (backplane) is available with or without the enclosure.
| Enclosure |
|
| Size |
6U cardframe x 300mm deep |
| Configuration |
160mm 3U front plug-in cards and
80mm rear transition cards |
| Cooling |
2x 120mm diameter 100CFM fans with air baffle plates |
| Power Supply |
650W ATX
5V @ 45A
3.3V @ 30A |
| Backplane |
|
| Type |
High TG FR4 |
| Thickness |
4.6mm |
| Layers |
20 |
| Controlled Impedance |
65 Ohm PCI
100 Ohm Differential |
| Power/Ground |
1 oz Copper |
| Flammability |
UL 94V-0 |
| Power distribution |
M3 PEM studs |
| Dimensions/Fitting Points |
3U cPCI to PCIMG 2.0 R3.0 |
| Signal Layout (PCI) |
32-bit PCI to PICMG 2.0 R3.0 |
| Signal Layout (Slot 6 PMC I/O to J2) |
PICMG 2.3 R1.0 |
| cPCI - 2mm Hard Metric Connectors |
| Pitch |
2mm |
| Environmental |
-50 degrees C to 125 degrees C |
| Mating Force |
0.75N per contact |
| Flammability |
UL 94V-0 |
| Contact Resistance |
20m Ohm max |
| ERmet ZD Connectors |
|
| Wafer pitch |
2.5mm |
| Signal pin pitch |
1.5mm |
| Environmental |
-50 degrees C to 125 degrees C |
| Mating Force |
0.7N per signal contact
0.9N per shield contact |
| Flammability |
UL 94V-0 |
| Differential Impedance |
100 Ohm |
| Impedance to ground |
50 Ohm |
| |
|
